Electronic device including interposer

ABSTRACT

An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is based on and claims priority under 35 U.S.C. §119(a) of a Korean patent application number 10-2019-0083250, filed onJul. 10, 2019, in the Korean Intellectual Property Office, thedisclosure of which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to an electronic device including an interposer.More particularly, the disclosure relates to an electronic deviceincluding an interposer formed in a multi-step or partition structure.

2. Description of Related Art

In order for electronic devices to be conveniently used by users and tohave an aesthetically pleasing appearance, a thickness of electronicdevices is being gradually reduced. The inner space in electronicdevices is therefore becoming limited and thus use of a structure inwhich different types of printed circuit boards (PCBs) are laminated isincreasing for efficient use of the inner space in the electronicdevices.

When a millimeter wave (mmWave) module is applied to a portableelectronic device, the portable electronic device may include aninterposer including a conductive member in order to secure space formounting electronic components or various active elements.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

An interposer may electrically connect substrates to each other. Theinterposer is formed to have a predetermined height and there may be thedifference between the height of electronic components mounted onsubstrates and the height of the space between the substrates. Arrangingsubstrates in consideration of the various heights of electroniccomponents is difficult and thus space may be wasted.

The interposer may be formed in a closed-curve shape along the edge of asubstrate so as to correspond to the shape of at least part of thesubstrate. Since the interposer supports the edge of the substrate, aregion that is not supported by the interposer is vulnerable to bendingor warping due to stress. Therefore, there is the need for methodcapable of reducing limitations due to the height or thickness ofelectronic components and of preventing warpage of a substrate.

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providean electronic device including an interposer formed in a multi-step orpartition structure so as to prevent the above-described warpage of asubstrate.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a first circuit board includinga first electronic component and a second electronic component disposedon a side of the first circuit board, a second circuit board spacedapart from the first circuit board and having a side facing the side ofthe first circuit board on which the first electronic component and thesecond electronic component are disposed, a first interposer disposedbetween the first circuit board and the second circuit board to form aninner space between the first circuit board and the second circuitboard, and a second interposer disposed between the first circuit boardand the second circuit board to divide the inner space into a firstregion and a second region, wherein the first electronic component onthe first circuit board is disposed corresponding to the first region,and the second electronic component on the first circuit board isdisposed corresponding to the second region, and wherein the firstinterposer and the second interposer electrically connect the firstcircuit board to the second circuit board.

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a first circuit board, a firstinterposer disposed on the first circuit board and having a firstheight, a second circuit board disposed on the first interposer andelectrically connected to the first interposer, a second interposerdisposed on the first circuit board so as to be formed outside the firstinterposer and having a second height, and a third circuit boarddisposed on the second interposer and electrically connected to thesecond interposer.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a first circuitboard, a first interposer disposed on the first circuit board and havinga first height, a second circuit board disposed on the first interposerand electrically connected to the first interposer, and a partitiondisposed inside the first interposer and formed to support at least aportion of the second circuit board.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a first circuit boardwhich includes a first surface, on which at least one component isdisposed and which faces in a first direction, and a second surfacefacing in the opposite direction of the first direction, a firstinterposer which is disposed on the first surface of the first circuitboard, is electrically connected to the first circuit board, andincludes a first region having a first height with reference to thefirst surface of the first circuit board and a second region having asecond height with reference to the first surface, a second interposerwhich is disposed on the first surface of the first circuit board, iselectrically connected to the first circuit board, and includes a thirdregion having the first height with reference to the first surface ofthe first circuit board, a second circuit board which faces the firstsurface of the first circuit board and is disposed on the first regionof the first interposer and on the third region of the secondinterposer, and a third circuit board which faces the first surface ofthe first circuit board and is disposed on the second region of thefirst interposer.

In accordance with another aspect of the disclosure, an electronicdevice including an interposer can laminate multiple substrates and thuscan increase efficiency of use of space in the vertical direction.

In accordance with another aspect of the disclosure, an electronicdevice including an interposer is provided. The electronic deviceincludes a partition capable of supporting a substrate and thus canprevent warpage of the substrate. The electronic device enableselectronic components to be disposed in regions separated by thepartition, and thus can reduce signal interference therebetween.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view showing an electronic device according toan embodiment of the disclosure;

FIG. 2 is a perspective view of the electronic device of FIG. 1 whenseen from the rear according to an embodiment of the disclosure;

FIG. 3 is an exploded perspective view of the electronic device of FIG.1 according to an embodiment of the disclosure;

FIG. 4 is a perspective view illustrating a circuit board on which aninterposer including a partition is disposed according to an embodimentof the disclosure;

FIG. 5 is a cross-sectional view taken by cutting the circuit board ofFIG. 4 in the direction A-A′ according to an embodiment of thedisclosure;

FIG. 6 is a perspective view illustrating a circuit board on which aninterposer including a stepped portion is disposed according to anembodiment of the disclosure;

FIG. 7 is a cross-sectional view taken by cutting the circuit board ofFIG. 6 in the direction B-B′ according to an embodiment of thedisclosure;

FIG. 8 illustrates modified coupling between an interposer and somesubstrates in a circuit board according to an embodiment of thedisclosure;

FIG. 9 illustrates a structure in which a circuit board further includesan additional circuit board according to an embodiment of thedisclosure;

FIG. 10 is a perspective view illustrating a circuit board on which aninterposer including a partition having a stepped portion is disposedaccording to an embodiment of the disclosure;

FIG. 11 is a cross-sectional view taken by cutting the circuit board ofFIG. 10 in the direction C-C′ according to an embodiment of thedisclosure;

FIG. 12 is a perspective view illustrating a circuit board on which aninterposer including a stepped portion and a partition is disposedaccording to an embodiment of the disclosure;

FIG. 13 is a cross-sectional view of a circuit board on which aninterposer including a stepped portion and a partition is disposedaccording to an embodiment of the disclosure;

FIG. 14A illustrates the process of manufacturing an interposerincluding a stepped portion according to an embodiment of thedisclosure;

FIG. 14B illustrates the process of manufacturing an interposerincluding a stepped portion according to an embodiment of thedisclosure; and

FIG. 14C illustrates the process of manufacturing an interposerincluding a stepped portion according to an embodiment of thedisclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a perspective view showing an electronic device 100 when seenfrom the front according to an embodiment of the disclosure.

FIG. 2 is a perspective view of the electronic device 100 of FIG. 1 whenseen from the rear according to an embodiment of the disclosure.

Referring to FIGS. 1 and 2, an electronic device 100 according to anembodiment may include: a housing 110 including a first face (or a frontface) 110A, a second face (or a rear face) 110B, and a side face 110Csurrounding the space between the first face 110A and the second face110B. In another embodiment (not illustrated), the term “housing” mayrefer to a structure forming some of the first face 110A, the secondface 110B, and the side face 110C of FIG. 1.

According to an embodiment, at least a portion of the first face 110Amay be formed of a substantially transparent front plate 102 (e.g., aglass plate or a polymer plate including various coating layers).According to embodiments, the front plate 102 may have a curved portionbending and seamlessly extending from a first face 110A to a rear plate111 at least at a side edge portion.

According to embodiments, the second face 110B may be formed of asubstantially opaque rear plate 111. The rear plate 111 may be formedof, for example, and without limitation, coated or colored glass,ceramic, a polymer, a metal (e.g., aluminum, stainless steel (STS), ormagnesium), or a combination of two or more of these materials.According to an embodiment, the rear plate 111 may have a curved portionbending and seamlessly extending from the second face 110B to the frontplate 102 at least at a side edge portion.

According to various embodiments, the side 110C is combined with a frontplate 102 and a rear plate 111 and may be formed by a lateral bezelstructure 118 (or a “lateral member or a side wall”) including metaland/or a polymer. In an embodiment, the rear plate 111 and the lateralbezel structure 118 may be integrated and may include the same material(e.g., a metallic material such as aluminum).

According to an embodiment, the electronic device 100 may include atleast one of a display 101, audio modules 103 and 114, sensor modules,camera modules 105, key input devices 117, and connector holes 108. Insome embodiments, in the electronic device 100, at least one of thecomponents (e.g., the key input devices 117) may be omitted, or othercomponents may be additionally included.

For example, an electronic device 100 may include a sensor module notshown. For example, a sensor including a proximity sensor or anillumination sensor may be integrated with a display 101 or may bedisposed adjacent to the display 101 in a region that is provided by thefront plate 102. In an embodiment, the electronic device 100 may furtherinclude a light emitting element and the light emitting element may bedisposed adjacent to the display 101 in the region that is provided bythe front plate 102. The light emitting element, for example, mayprovide state information of the electronic device 100 in a light type.In another embodiment, the light emitting element, for example, mayprovide a light source that operates with the operation of a cameramodule 105. The light emitting element, for example, may include alight-emitting diode (LED), an infrared (IR) LED, and a xenon lamp.

The display 101 may be exposed through, for example, a large portion ofthe front plate 102. In some embodiments, the edges of the display 101may be formed to be substantially the same as the contour shape of thefront plate 102 adjacent thereto. In another embodiment (not shown), thedistance between the outer contour of the display 101 and the outercontour of the front plate 102 may be substantially constant in order toenlarge the exposed area of the display 101.

In another embodiment (not shown), a recess or an opening may be formedin a portion of a display region of the display 101, and otherelectronic devices aligned with the recess or the opening such as acamera module 105 and a proximity sensor or an illumination sensor (notshown) may be included.

In another embodiment (not shown), at least one of the camera modules112 and 113, the fingerprint sensor 116, and the light-emitting element106 may be included in the rear face of the screen display area of thedisplay 101. In another embodiment (not shown), the display 101 may becoupled to or disposed adjacent to a touch-sensing circuit, a pressuresensor that is capable of measuring the intensity of the touch(pressure), and/or a digitizer that detects a magnetic-field-type styluspen.

The audio modules 103 and 114 may include a microphone hole and speakerholes. The microphone hole may include a microphone disposed therein soas to acquire external sound, and in some embodiments, multiplemicrophones may be disposed therein so as to detect the direction ofsound. In some embodiments, the speaker holes and the microphone holemay be implemented as a single hole 103, or a speaker may be includedtherein without the speaker holes (e.g., a piezo speaker). The speakerholes may include an external speaker hole and a phone call receiverhole 114.

The electronic device 100 may include a one or more sensor modules (notshown) to generate electrical signals or data values corresponding tothe internal operating state or the external environmental state of theelectronic device 100. The sensor modules may include, for example, aproximity sensor disposed on the first face 110A of the housing, afingerprint sensor integrated or adjacent to the display 101, and/orheart rate monitor (HRM) sensor disposed on the second face 110B of thehousing 110. The electronic device 100 may further include at least oneof sensors (not shown) such as, for example, and without limitation, agesture sensor, a gyro sensor, an atmospheric pressure sensor, amagnetic sensor, an acceleration sensor, a grip sensor, a color sensor,an infrared (IR) sensor, a biosensor, a temperature sensor, a humiditysensor, an illuminance sensor, or the like.

The camera modules 105, 112, 113, and 106 may include a first cameradevice 105 disposed on the first face 110A of the electronic device 100and a second camera device 112 and 113 disposed on the second face 110B,and/or a flash 106. The camera devices 105, 112 and 113 may include oneor more lenses, an image sensor, and/or an image signal processor. Theflash 106 may include, for example, a light-emitting diode or a xenonlamp. In some embodiments, two or more lenses (e.g., an infrared cameralens, a wide-angle lens, and a telephoto lens) and image sensors may bedisposed on one face of the electronic device 100.

The key input devices 117 may be disposed on the side faces 110C of thehousing 110. In another embodiment, the electronic device 100 may notinclude some or all of the above-mentioned key input devices 117, and akey input device 117, which is not included therein, may be implementedin another form, such as that of a soft key or the like on the display101. In some embodiments, the key input devices may include a sensormodule 116 disposed on the second face 110B of the housing 110.

The connector holes 108 may be capable of accommodating a connector fortransmitting and receiving power and/or data to and from an externalelectronic device, and/or a connector for transmitting and receiving anaudio signal to and from an external electronic device. For example, theconnector holes 108 may include universal serial bus (USB) connector orearphone jack.

FIG. 3 is an exploded perspective view of the electronic device of FIG.1 according to an embodiment of the disclosure.

Referring to FIG. 3, an electronic device 200 may include a side bezelstructure 210, a first support member 211 (e.g., a bracket), a frontplate 220, a display 230, a PCB 240, a battery 250, a second supportmember 260 (e.g., a rear case), an antenna 270, and a rear plate 280. Insome embodiments, at least one of the components (e.g., the firstsupport member 211 or the second support member 260) may be omitted fromthe electronic device 200, or the electronic device 200 may additionallyinclude other components. At least one of the components of theelectronic device 200 may be the same as or similar to at least one ofthe components of the electronic device 100 of FIG. 1 or FIG. 2, and aredundant description may not be repeated here.

The first support member 211 may be disposed inside the electronicdevice 200 and may be connected to the side bezel structure 210, or maybe formed integrally with the side bezel structure 210. The firstsupport member 211 may include, for example, a metal material and/or anon-metal (e.g., polymer) material. The display 230 may be coupled toone face of the first support member 211, and the PCB 240 may be coupledto the other face of the first support member 332. On the PCB 240, aprocessor, a memory, and/or an interface, or the like, may be mounted.The processor may include various processing circuitry including atleast one of, for example, and without limitation, a central processingunit, an application processor, a graphic processor, an image signalprocessor, a sensor hub processor, a communication processor, or thelike.

The memory may include, for example, volatile memory and/or nonvolatilememory.

The interface may include, for example, and without limitation, ahigh-definition multimedia interface (HDMI), a universal serial bus(USB) interface, a secure digital (SD) card interface, and/or an audiointerface, or the like. The interface may electrically or physicallyconnect, for example, the electronic device 200 to an externalelectronic device, and may include, for example, and without limitation,a USB connector, an SD card/a multimedia card (MMC) connector, an audioconnector, or the like.

The battery 250 is a device for supplying power to at least onecomponent of the electronic device 200, and may include, for example,and without limitation, a non-rechargeable primary battery, arechargeable secondary battery, a fuel cell, or the like. At least aportion of the battery 250 may be disposed to be substantially flushwith, for example, the PCB 240. The battery 250 may be integrallydisposed within the electronic device 200, or may be detachably mountedon the electronic device 200.

The antenna 270 may be disposed between the rear plate 280 and thedisplay 230. The antenna 270 may include, for example, and withoutlimitation, a near-field communication (NFC) antenna, a wirelesscharging antenna, and/or a magnetic secure transmission (MST) antenna,or the like. The antenna 270 may perform short-range communication with,for example, an external electronic device, or may transmit/receivepower used for charging to/from the external device in a wirelessmanner. In another embodiment, an antenna structure may be formed by theside bezel structure 210, a portion of the first support member 211, ora combination thereof.

FIG. 4 is a perspective view illustrating a circuit board on which aninterposer including a partition is disposed according to an embodimentof the disclosure.

FIG. 5 is a cross-sectional view taken by cutting the circuit board ofFIG. 4 in the direction A-A′ according to an embodiment of thedisclosure.

Referring to FIG. 4, an electronic device 400 may include a firstcircuit board 410 (e.g., the printed circuit board 240 in FIG. 3), asecond circuit board 420, and a first interposer 430 forming an innerspace between the first circuit board 410 and the second circuit board420. The first interposer 430 may be formed as a closed curvesurrounding the inner space formed in the first circuit board 410 andthe second circuit board 420 in order to shield the inner space. Thefirst interposer 430 may be formed in a shape in which a through-hole isformed in a prism having a polygonal base. In one example, the firstinterposer 430 may be formed in a shape in which one through-hole isformed in a square prism.

According to one embodiment, the electronic device 400 may include asecond interposer 432 used as a partition. The second interposer 432 maybe disposed across the inner space formed by the first interposer 430 todivide the inner space into two regions. In one example, the secondinterposer 432 may divide the inner space among the first interposer430, the first circuit board 410, and the second circuit board 420 intoa first region 430A and a second region 430B. In one example, the secondinterposer 432 may support at least one region of the second circuitboard 420 (e.g., a second surface 422 of the second circuit board 420).

According to various embodiments, the first circuit board 410 mayinclude a first surface 411 facing in a first direction 41 and a secondsurface 412 facing in a second direction 42. Various electroniccomponents 450 (e.g., a processor, a modem chip, and various types ofactive elements) may be arranged on the first surface 411 of the firstcircuit board 410. The first circuit board 410 may include a ground anda wire for electrically connecting one or more electronic components450. The second circuit board 420 may include a second surface 422facing the first surface 411 of the first circuit board 410 and a firstsurface 421 facing in the opposite direction of the second surface 422of the second circuit board 420.

According to one embodiment, electronic components may be arranged onthe first surface 421 of the second circuit board 420. According toanother embodiment, electronic components may be arranged on the secondsurface 422 of the second circuit board 420. The electronic componentsarranged on the second surface 422 of the second circuit board 420 maybe arranged so as to be prevented from interfering with the electroniccomponents 450 arranged on the first surface 411 of the first circuitboard 410.

In various embodiments, the first interposer 430 may be arranged betweenthe first circuit board 410 and the second circuit board 420 so as tosurround the space between the first circuit board 410 and the secondcircuit board 420. Through the above-described arrangement of the firstinterposer 430, an inner space may be formed among the first interposer430, the first circuit board 410, and the second circuit board 420.

In one embodiment, the second circuit board 420 may be disposed betweenthe first circuit board 410 and a rear plate (e.g., the rear plate 280in FIG. 3). That is, the second circuit board 420 may be disposed on thefirst surface 411 of the first circuit board 410 facing the rear plate280 (e.g., in the direction 41 in FIG. 4). In one example, the secondcircuit board 420 may be an antenna substrate for radiating an RFsignal. A communication module may be disposed on the first surface 421of the second circuit board 420 facing the rear plate 280. In this case,the second circuit board 420 may be disposed between the first circuitboard 410 and the rear plate 280 such that an RF signal radiated from anelectronic component (e.g., a communication module) of the secondcircuit board 420 passes through at least a portion of the region of therear plate 280.

In another embodiment, the second circuit board 420 may be disposedbetween the first circuit board 410 and a first support member (e.g.,the support member 211 in FIG. 3). The second circuit board 420 mayinclude one or more electric elements, a wire for electricallyconnecting the electric elements, and a ground.

In one embodiment, the first interposer 430 may be disposed between thefirst surface 411 of the first circuit board 410 and the second surface422 of the second circuit board 420 so as to connect the first surface411 to the second surface 422. The first interposer 430 may include atleast one conductive member 435 for electrically connecting the firstcircuit board 410 or the at least one electronic component 450 arrangedon the first circuit board 410 to the second circuit board 420 or atleast one electronic component arranged on the second circuit board.

According to one embodiment, the first interposer 430 may include aplurality of wall portions formed of a non-conductive member and mayinclude the at least one conductive member 435 (e.g., a conductive via)passing through the plurality of wall portions. In one embodiment, theplurality of wall portions may be disposed along peripheral portions ofthe first circuit board 410 and the second circuit board 420. By thestructure of the plurality of wall portions of the first interposer 430,the inner space may be formed. For example, the inner space may beenclosed by the first circuit board 410, the second circuit board 420,and the first interposer 430. In one embodiment, at least onethrough-holes may be formed through the plurality of wall portions ofthe first interposer 430, and the at least one conductive member 435 maypass through the plurality of wall portions of the first interposer 430.For example, some of the conductive members 435 may be power lines, andthe others thereof may be formed as signal transmission lines. Theconductive member 435 may transmit electric power transferred from abattery (e.g., the battery 250 in FIG. 3) to at least one electroniccomponent included in the first circuit board 410 or in the secondcircuit board 420, and may transmit or receive, to or from a processor,signals between electronic components arranged on the first circuitboard 410 and on the second circuit board 420.

According to one embodiment, the second interposer 432 may include awall portion formed of a non-conductive member, and may include at leastone conductive member. In one embodiment, the wall portion of the secondinterposer 432 may be disposed across the inner space formed by thefirst circuit board 410, the second circuit board 420 and the firstinterposer 430. For example, the wall portion of the second interposer432 extends from one of the plurality of the wall portions of the firstinterposer 430 to another one of the plurality of the wall portions ofthe first interposer 430. In one embodiment, at least one through-holeis formed in the wall portion of the second interposer 432, and thus theat least one conductive member may pass through the wall portion of thesecond interposer 432. An electronic device according to one embodimentmay electrically connect an electronic component included in the firstcircuit board 410 to an electronic component included in the secondcircuit board 420 through the first interposer 430 and/or the secondinterposer 432 described above.

Referring to FIG. 5, as illustrated in FIG. 4, the first interposer 430may include: a body 431 formed in a closed-curve shape so as to shieldthe inner space formed between the first circuit board 410 and thesecond circuit board 420; a conductive member 435 passing through theinside of the body 431; and a conductive frame 441 formed along theouter side surface of the body 431 surrounding the inner space formedbetween the first circuit board 410 and the second circuit board 420.For example, the conductive frame 441 may have a shield surface facingin a third direction 43, 44, 45, and/or 46 substantially perpendicularto the first direction 41 or the second direction 42. The conductiveframe 441 is a band-shaped component in which the shielding surface iselongated in one direction, and may surround the inner space of alaminated-type PCB substrate. According to various embodiments, theinner space surrounded by the conductive frame 441 may be substantiallysealed, but an unsealed structure having a minute groove or slit thereinis also usable, provided that the unsealed structure guarantees ashielding effect. The conductive frame 441 may shield the inner space ofthe laminated-type PCB structure, which is formed by the firstinterposer 430.

According to various embodiments, the conductive frame 441 may bedisposed on the circuit board 410 so as to surround the at least oneelectronic component 450. According to one embodiment, the conductiveframe 441 may be electrically connected to a ground portion of thecircuit board 410.

According to various embodiments, the second interposer 432 may bedisposed in the inner space formed by the first interposer 430, thefirst circuit board 410, and the second circuit board 420 so as todivide the inner space. For example, the second interposer 432 may bedisposed in the inner space so as to divide the inner space into thefirst region 430A and the second region 430B. The electronic component450 may be arranged in each of the regions into which the inner space isdivided by the second interposer 432. For example, a first electroniccomponent 451 may be disposed in the first region 430A separated by thesecond interposer 432, and a second electronic component 452 and a thirdelectronic component 453 may be arranged in the second region 430B.

According to one embodiment, the first interposer 430 may be formed tohave a first height, and the second interposer 432 may be formed to havea second height. In one embodiment, the first height and the secondheight may be equal to each other, but are not limited thereto.

According to one embodiment, the second interposer 432 may support atleast a portion of the second circuit board 420. The second interposer432 may support at least a portion of the second circuit board 420 andthus may play the role of preventing the second circuit board 420 fromwarping.

FIG. 6 is a perspective view illustrating a circuit board on which aninterposer including a stepped portion is disposed according to anembodiment of the disclosure.

Referring to FIG. 6, an electronic device 600 may include a firstcircuit board 610 (e.g., the printed circuit board 240 in FIG. 3), asecond circuit board 620, a third circuit board 670, and an interposer630 having a multi-step structure.

According to various embodiments, a second surface 612 of the firstcircuit board 610 is attached to and supported by one surface of asupport member (e.g., the support member 211 in FIG. 3). At least onefirst electronic component 650 (e.g., the electronic component 450 inFIG. 4) may be disposed on a first surface 611 of the first circuitboard 610.

According to one embodiment, a first interposer 633 a may be formed tohave a first height (h1), and may be disposed on the first surface 611of the first circuit board 610. The first interposer 633 a may bedisposed so as to surround the at least one electronic component 650disposed on the first surface 611 of the first circuit board 610. Asecond interposer 632 may be disposed on the first surface 611 of thefirst circuit board 610 so as to be formed outside the first interposer633 a. For example, the second interposer 632 may be formed along theouter edge of the first interposer 633 a so as to surround the firstinterposer 633 a. According to various embodiments, the secondinterposer 632 and the first interposer 633 a may be integrated witheach other.

According to various embodiments, the second interposer 632 may beformed to have a second height (h2). The second height (h2) may begreater than the first height (h1). For example, the interposerincluding the first interposer 633 a and the second interposer 632 maybe formed to be high at the outer edge thereof and may be formed be lowat a side facing a region including the electronic component 650.According to various embodiments, one surface of each of the firstinterposer 633 a and the second interposer 632 may be disposed on thefirst surface 611 of the first circuit board 610. Another surface of thefirst interposer 633 a and another surface of the second interposer 632,each of which faces the surface of the interposer that is in contactwith the first circuit board 610, may be formed to have differentheights. For example, the interposer may include a stepped portion atthe boundary between the first interposer 633 a and the secondinterposer 632.

According to various embodiments, a second surface 622 of the secondcircuit board 620 may form an inner space while facing the first surface611 of the first circuit board 610. The second surface 622 of the secondcircuit board 620 may be in contact with the other surface of the secondinterposer 632. The first circuit board 610 and the second circuit board620 may be electrically connected to each other by the second interposer632.

According to various embodiments, the third circuit board 670 may beformed to be smaller than the second circuit board 620. For example, thethird circuit board 670 may be disposed inside the stepped portionformed by the first interposer 633 a and the second interposer 632, andthe second circuit board 620 may be disposed on a high surface extendingfrom the stepped portion formed by the first interposer 633 a and thesecond interposer 632. For example, the third circuit board 670 may besupported by the first interposer 633 a, and the second circuit board620 may be supported by the second interposer 632. A conductive member635 included in the first interposer 633 a may be connected to a wire ofthe first circuit board 610 and to a wire of the third circuit board 670so as to electrically connect the circuit boards to each other.

According to various embodiments, a second surface 672 of the thirdcircuit board 670 may form an inner space while facing the first surface611 of the first circuit board 610. The second surface 672 of the thirdcircuit board 670 may be in contact with the other surface of the firstinterposer 633 a. The first circuit board 610 and the third circuitboard 670 may be electrically connected to each other. According tovarious embodiments, the at least one electronic component 650 mountedon the first circuit board 610 may be electrically connected to anelectronic component 680 (e.g., a communication circuit, an activeelement) mounted on the third circuit board 670 by the first interposer633 a. The third circuit board 670 may include a signal transmissionwire or a power wire.

FIG. 7 is a cross-sectional view taken by cutting the circuit board ofFIG. 6 in the direction B-B′ according to an embodiment of thedisclosure.

Referring to FIG. 7, the first interposer 633 a, the second interposer632, and the at least one electronic component 650 may be mounted on thefirst surface 611 of the first circuit board 610. An interposer (e.g.,the interposer 630 in FIG. 6) may be disposed to surround the region inwhich the at least one electronic component 650 is disposed. Forexample, the interposer (e.g., the interposer 630 in FIG. 6) may bedisposed outside and around the electronic component 650.

For example, the interposer 630 may include the first interposer 633 ahaving the first height (h1) and the second interposer 632 having thesecond height (h2). According to various embodiments, the secondinterposer 632 may be disposed outside and around the first interposer633 a. The first interposer 633 a and the second interposer 632 may beintegrated with each other, and a stepped portion may be formed at theboundary between the first interposer 633 a and the second interposer632. One end of the first interposer 633 a may be surface-mounted on thefirst surface 611 of the first circuit board 610. The other end of thefirst interposer 633 a may be surface-mounted on the second surface 672of the third circuit board 670 so as to support at least a portion ofthe third circuit board 670. At least one electronic component 680 or685 may be disposed on both a first surface 671 and the second surface672 of the third circuit board 670. According to one embodiment, theterm “surface mount” refers to directly mounting a component (e.g., thefirst interposer 633 a) on a circuit board (e.g., the third circuitboard 670), and is also used below with the same meaning.

According to various embodiments, the at least one electronic component650 disposed on the first surface 611 of the first circuit board 610 andthe at least one electronic component 685 disposed on the second surface672 of the third circuit board 670 may be arranged in the space betweenthe third circuit board 670 and the first circuit board 610. Theelectronic component 650 disposed on the first surface 611 of the firstcircuit board 610 may be disposed so as not to interfere with theelectronic component 685 disposed on the second surface 672 of the thirdcircuit board 670.

According to various embodiments, one end of the second interposer 632may be surface-mounted on the first surface 611 of the first circuitboard 610. The other end of the second interposer 632 may besurface-mounted on at least one side of the second surface 622 of thesecond circuit board 620 so as to support at least a portion of thesecond circuit board 620. At least one electronic component 690 or 695is disposed on both a first surface 621 and the second surface 622 ofthe second circuit board 620.

According to various embodiments, the electronic component 680 disposedon the first surface 671 of the third circuit board 670 and theelectronic component 695 disposed on the second surface 622 of thesecond circuit board 620 may be arranged in the space between the secondcircuit board 620 and the third circuit board 670. The at least oneelectronic component 680 disposed on the first surface 671 of the thirdcircuit board 670 may be disposed so as not to interfere with theelectronic component 695 disposed on the second surface 622 of thesecond circuit board 620.

Referring to FIG. 7, according to various embodiments, the interposer(e.g., the interposer 630 in FIG. 6) including the first interposer 633a and the second interposer 632 may include a body 634, conductivemembers 635 and 637 a, and a conductive frame 641. According to variousembodiments, at least one of the elements of the interposer may beidentical to or similar to at least one of the elements of theinterposer of FIG. 5 (e.g., the first interposer 430 in FIG. 5), andthus a redundant description thereof will be omitted. For example, theconductive frame 641 may have a shielding surface facing in a thirddirection (reference numerals 63, 64, 65, and/or 66 in FIG. 6)substantially perpendicular to the first direction (e.g., referencenumeral 61 in FIG. 6) or the second direction (e.g., reference numeral62 in FIG. 6).

The conductive member 637 a included in the first interposer 633 a maybe connected to the wire of the first circuit board 610 and to the wireof the third circuit board 670 so as to electrically connect the circuitboards to each other. Conductive pads 631 are added to respectiveopposite ends of the conductive member 637 a. The conductive pads 631may be in electrical contact with the wire of the first circuit board610 and the wire of the third circuit board 670, respectively, and maytransfer an electrical signal or electric power. Differing from theabove description, the first interposer 633 a may be formed at one inneredge of the second interposer 632. According to one embodiment, theelectronic device 600 may include an additional first interposer 633 bidentical to the first interposer 633 a having the first height (h1).According to one embodiment, the first interposer 633 a may be formed inthe shape of a closed curve 633 c surrounding an inner space between thefirst circuit board 610 and the third circuit board 670. Like the firstinterposer 633 a, the additional first interposer 633 b may be formed inthe shape of a closed curve 633 d surrounding an inner space between thefirst circuit board 610 and the third circuit board 670, and may includea conductive member 637 b and conductive pads 631. The first interposer633 a and the additional first interposer 633 b are spaced apart fromeach other. Therefore, an inner space 636, in which at least oneelectronic component (e.g., reference numeral 650 or 685) can bedisposed, may be formed between the first interposer 633 a and theadditional first interposer 633 b.

According to various embodiments, the at least one electronic component650 mounted on the first circuit board 610 may be electrically connectedto the electronic component mounted on the second circuit board 620 bythe second interposer 632. The conductive member 635 included in thesecond interposer 632 may be connected to the wire of the first circuitboard 610 and to the wire of the second circuit board 620 so as toelectrically connect the circuit boards to each other. Conductive pads631 may be added to respective opposite ends of the conductive member635. The conductive pads 631 may be in contact with the wire of thefirst circuit board 610 and the wire of the second circuit board 620,respectively, and may transfer an electrical signal or electric power.

According to various embodiments, the inner space surrounded by theconductive frame 641 may be substantially sealed, but an unsealedstructure having a minute groove or slit therein is also usable,provided that the unsealed structure guarantees a shielding effect. Theconductive frame 641 may shield the inner space of the laminated-typePCB structure, which is formed by the interposer 630.

According to various embodiments, the conductive frame 641 may bedisposed on the circuit board 610 so as to surround the at least oneelectronic component 650, 680, 685, 690, and/or 695. According to oneembodiment, the conductive frame 641 may be electrically connected to aground portion of the circuit board 610.

FIG. 8 illustrates modified coupling between an interposer and somesubstrates in a circuit board according to an embodiment of thedisclosure.

Referring to FIG. 8, the conductive pad 631 of the second circuit board620, among the conductive pads 631 formed at the ends of the conductivemembers 638 a and 637 b of the first interposers 633 a and 633 b, may beconnected to the third circuit board 670 by a conductive wire 639.According to one embodiment, the conductive wire 639 may be a bondingwire. A bonding wire may be a wire material for electrically connectinga lead on a substrate (e.g., the third circuit board 670) to aconductive pad (e.g., the conductive pads 631). In one example, thebonding wire may be formed of gold, aluminum, etc. One end of theconductive wire 639 may be connected to the wire of the third circuitboard 670, and the other end of the conductive wire 639 may be connectedto the conductive pads 631 formed on the first interposers 633 a and 633b. Thus, the first circuit board 610 may be electrically connected tothe third circuit board 670.

FIG. 9 illustrates a structure in which a circuit board further includesan additional circuit board according to an embodiment of thedisclosure.

Referring to FIG. 9, a first interposer 633 may be formed to protrudefrom the second interposer 632. The first interposer 633 may extend fromthe central portion of the second interposer 632 toward an inner space.According to various embodiments, the first interposer 633 mayelectrically connect a third circuit board 670 a to a fourth circuitboard 670 b. Electronic components 680 a and 680 b may be mounted on onesurface of the third circuit board 670 a and on one surface of thefourth circuit board 670 b, respectively. The first interposer 633 mayrealize an electrical connection between the electronic components 680 aand 680 b which are mounted on the one surface of the third circuitboard 670 a and on the one surface of the fourth circuit board 670 b,respectively.

FIG. 10 is a perspective view illustrating a circuit board on which aninterposer including a partition having a stepped portion is disposedaccording to an embodiment of the disclosure.

Referring to FIG. 10, an electronic device 1000 may include: a firstcircuit board 1010 (e.g., the printed circuit board 240 in FIG. 3); asecond circuit board 1020 a; a third circuit board 1020 b; a firstinterposer 1030 forming an inner space between the first circuit board1010 and the second circuit board 1020 a; and a second interposer 1032forming an inner space between the first circuit board 1010 and thethird circuit board 1020 b. The first interposer 1030 is formed in theshape of a closed curve (e.g., reference numeral 1042 in FIG. 11)surrounding the inner space formed between the first circuit board 1010and the second circuit board 1020 a, and thus the inner space, in whichthe first interposer 1030 is disposed, can be completely shielded.According to one embodiment, the first interposer 1030 may be formed ina shape in which a through-hole is formed in a prism having a polygonalbase. The second interposer 1032 is formed in the shape of a closedcurve (e.g., reference numeral 1043 in FIG. 11) surrounding the innerspace formed between the first circuit board 1010 and the third circuitboard 1020 b, and thus the inner space, in which the second interposer1032 is disposed, can be completely shielded. Like the first interposer1030, the second interposer 1032 may be formed in a shape in which athrough-hole is formed in a prism having a polygonal base.

According to one embodiment, the first interposer 1030 and the secondinterposer 1032 may be formed as one interposer. The one interposer mayinclude a first wall (reference numeral 1030 a in FIG. 11) and a secondwall (reference numeral 1030 b in FIG. 11), and a stepped portion(reference numeral 1033 in FIG. 11) may be formed between the first wall(reference numeral 1030 a in FIG. 11) and the second wall (referencenumeral 1030 b in FIG. 11) due to the height difference between thefirst wall (reference numeral 1030 a in FIG. 11) and the second wall(reference numeral 1030 b in FIG. 11).

According to various embodiments, the first interposer 1030 may beformed to have a first height, and the second interposer 1032 may beformed to have a second height different from the first height. Theheight of the first interposer 1030 and the second interposer 1032 maybe determined depending on the height of at least one electroniccomponent 1050 a and 1050 b arranged in the inner spaces formed by therespective interposers. In one example, when one component (e.g.,reference numeral 1050 a) among the at least one electronic componenthas a greater height than another component (e.g., reference numeral1050 b) among the at least one electronic component, an interposer(e.g., the first interposer 1030) having a greater height may be formedfor the electronic component (e.g., reference numeral 1050 a) having agreater height, and an interposer (e.g., the second interposer 1032)having a relatively small height may be formed for the electroniccomponent (e.g., reference numeral 1050 b) having a relatively smallheight.

According to various embodiments, the first circuit board 1010 mayinclude: a first surface 1011 facing in a first direction; and a secondsurface 1012 facing in a second direction. Various electronic componentsmay be arranged on the first surface 1011 of the first circuit board1010. The first circuit board 1010 may include a ground and a wire forelectrically connecting one or more electronic components 1050 a and1050 b. Multiple electronic components 1050 a and 1050 b may be mountedon the first circuit board 1010. The electronic components 1050 a and1050 b mounted on the first circuit board 1010 may be arranged in aninner space 1051 formed by the first interposer 1030 or in an innerspace 1052 formed by the second interposer 1032.

According to various embodiments, the second circuit board 1020 a mayinclude: a second surface 1022 a facing the first surface 1011 of thefirst circuit board 1010; and a first surface 1021 a facing the secondsurface 1022 a of the second circuit board 1020 a. The second circuitboard 1020 a may include an electronic component disposed on the firstsurface 1021 a. According to another embodiment, an electronic component1070 mounted on the second circuit board 1020 a may be disposed in aninner space formed between the second circuit board 1020 a and the firstcircuit board 1010. For example, an electronic component may be disposedon the second surface 1022 a of the second circuit board 1020 a. Atleast one electronic component 1070 disposed on the second surface 1022a of the second circuit board 1020 a may be disposed so as to beprevented from interfering with the electronic components 1050 adisposed on the first surface 1011 of the first circuit board 1010.

In various embodiments, the first interposer 1030 may be disposedbetween the first circuit board 1010 and the second circuit board 1020 aso as to surround the inner space between the first circuit board 1010and the second circuit board 1020 a.

According to various embodiments, the third circuit board 1020 b mayinclude: a second surface 1022 b facing the first surface 1011 of thefirst circuit board 1010; and a first surface 1021 b facing the secondsurface 1022 b of the third circuit board 1020 b. At least oneelectronic component may be disposed on the first surface 1021 b of thethird circuit board 1020 b. In various embodiments, the secondinterposer 1032 may be disposed between the first circuit board 1010 andthe third circuit board 1020 b so as to surround the inner space betweenthe first circuit board 1010 and the third circuit board 1020 b.According to one embodiment, the second interposer 1032 may be formed tohave a second height, and the second height may be a height enabling theelectronic component 1050 b to be disposed on at least one surface ofthe first circuit board 1010 in the space formed by the secondinterposer 1032.

FIG. 11 is a cross-sectional view taken by cutting the circuit board ofFIG. 10 in the direction C-C′ according to an embodiment of thedisclosure. FIG. 11 illustrates a configuration in which at least oneinterposer and a conductive member of an electronic device are arranged.

Referring to FIG. 11, the first interposer 1030 may connect the firstsurface 1011 of the first circuit board 1010 to the second surface 1022a of the second circuit board 1020 a. The second interposer 1032 mayconnect the first surface 1011 of the first circuit board 1010 to thesecond surface 1022 b of the third circuit board 1020 b. The firstinterposer 1030 may include a conductive member 1035 a for electricallyconnecting the first circuit board 1010 or at least one electroniccomponent 1050 a and 1050 b included in the first circuit board 1010 tothe second circuit board 1020 a or at least one electronic componentincluded in the second circuit board 1020 a. The second interposer 1032may include a conductive member 1035 b for electrically connecting thefirst circuit board 1010 or the at least one electronic component 1050 aand 1050 b included in the first circuit board 1010 to the third circuitboard 1020 b or at least one electronic component included in the thirdcircuit board 1020 b. The first interposer 1030 and the secondinterposer 1032 include respective bodies made of non-conductivemembers, and may include the conductive members 1035 a and 1035 b (e.g.,conductive vias) passing through the bodies, respectively. Some of theconductive members 1035 a may be power lines, and the others thereof maybe signal transmission lines.

According to various embodiments, the first interposer 1030 and thesecond interposer 1032 may be integrated with each other. The firstinterposer 1030 may have a first height, and the second interposer 1032may have a second height smaller than the first height. Due to thedifference in the heights, a stepped portion may be formed at theboundary between the first interposer 1030 and the second interposer1032. A boundary region 1037 between the first interposer 1030 and thesecond interposer 1032, at which the stepped portion is formed, mayinclude: a region 1037 a having the first height and supporting thesecond circuit board 1020 a; and a region 1037 b having the secondheight and supporting the third circuit board 1020 b, and the region1037 a and the region 1037 b may form the stepped portion therebetween.

According to various embodiments, the first interposer 1030 is formed inthe shape of a closed curve surrounding an inner space formed betweenthe first circuit board 1010 and the second circuit board 1020 a, andmay include: a body 1042 capable of completely shielding an inner spacein which the first interposer 1030 is disposed; the conductive member1035 a passing through the inside of the body 1042; and a firstconductive frame 1041 a formed along the outer side surface of the body1042.

The second interposer 1032 is formed in the shape of a closed curvesurrounding an inner space formed between the first circuit board 1010and the third circuit board 1020 b, and may include: a body 1043 capableof completely shielding an inner space in which the second interposer1032 is disposed; the conductive member 1035 b passing through theinside of the body 1043; and a second conductive frame 1041 b formedalong the outer side surface of the body 1043.

For example, each of the first conductive frame 1041 a and the secondconductive frame 1041 b may have a shielding surface facing in a thirddirection (e.g., reference numerals 1003, 1004, 1005, and/or 1006)substantially perpendicular to the first direction (e.g., referencenumeral 1001 in FIG. 10) or the second direction (e.g., referencenumeral 1002 in FIG. 10). Each of the first conductive frame 1041 a andthe second conductive frame 1041 b is a band-shaped component in whichthe shielding surface is elongated in one direction, and may surround aspace inside a laminated-type PCB substrate.

According to various embodiments, the first conductive frame 1041 a maybe disposed on the first circuit board 1010 so as to surround the atleast one electronic component 1050 a. According to one embodiment, thefirst conductive frame 1041 a may be electrically connected to a groundportion of the first circuit board 1010. The second conductive frame1041 b may be disposed on the first circuit board 1010 so as to surroundthe at least one electronic component 1050 b, and may be electricallyconnected to the ground portion of the first circuit board 1010.

According to another embodiment, the first conductive frame 1041 a andthe second conductive frame 1041 b may be integrated with each other.For example, the first conductive frame 1041 a and the second conductiveframe 1041 b may be formed along the outside of an interposer includingthe first interposer 1030 and the second interposer 1032, which areintegrated with each other.

FIG. 12 is a perspective view illustrating a circuit board on which aninterposer including a stepped portion and a partition is disposedaccording to an embodiment of the disclosure.

Referring to FIG. 12, an electronic device 1200 may include a firstcircuit board 1210, a second circuit board 1220 a, a third circuit board1270 a, a fourth circuit board 1270 b, and an interposer 1230.

According to various embodiments, at least one electronic component 1250a and 1250 b and the interposer 1230 may be mounted on a first surfaceof the first circuit board 1210. One surface of the interposer 1230 maybe formed such that an entirety thereof is in contact with first circuitboard 1210. Another surface of the interposer 1230 may include a steppedportion to allow the second circuit board 1220 a, the third circuitboard 1270 a, and the fourth circuit board 1270 b to be arranged.

The at least one component 1250 a may be installed in an inner space1251 between the first circuit board 1210 and the third circuit board1270 a, and another component 1250 b mounted on the first circuit board1210 may be installed in an inner space 1252 between the first circuitboard 1210 and the fourth circuit board 1270 b. According to variousembodiments, at least one electronic component 1280 a or 1280 b may bemounted on the third circuit board 1270 a or on the fourth circuit board1270 b.

FIG. 13 is a cross-sectional view of a circuit board on which aninterposer including a stepped portion and a partition is disposedaccording to an embodiment of the disclosure.

Referring to FIG. 13, the interposer 1230 may include a first interposer1230 b, a second interposer 1230 a, and a third interposer 1232. Thefirst interposer 1230 b may be disposed so as to surround the electroniccomponents 1250 a and 1250 b arranged on the first circuit board 1210.The first interposer 1230 b may have a first height. The secondinterposer 1230 a may be disposed on the first circuit board 1210 so asto surround the outside of the first interposer 1230 b. The secondinterposer 1230 a may have a second height, which is greater than thefirst height.

According to various embodiments, the second circuit board 1220 a may bedisposed on the second interposer 1230 a. The third circuit board 1270 aand the fourth circuit board 1270 b may be arranged on the firstinterposer 1230 b.

According to one embodiment, the electronic device 1200 may include thethird interposer 1232, which is used as a partition. The thirdinterposer 1232 may be disposed across an inner space formed by thefirst interposer 1230 b so as to divide the inner space into tworegions. The third interposer 1232 may support the second circuit board1220 a. The third interposer 1232 may include: a protruding region whichhas the second height and is in contact with the second circuit board1220 a; and a region formed around the protruding region so as tosupport the third circuit board 1270 a and the fourth circuit board 1270b.

According to various embodiments, the first circuit board 1210 mayinclude: the at least one electronic component 1250 a disposed in aspace formed between the first circuit board 1210 and the third circuitboard 1270 a; and the at least one electronic component 1250 b disposedin a space formed between the first circuit board 1210 and the fourthcircuit board 1270 b. The at least one electronic component 1250 a and1250 b may be disposed in respective regions separated by the thirdinterposer 1232. According to various embodiments, the electroniccomponent 1280 a disposed in a space formed between the third circuitboard 1270 a and the second circuit board 1220 a may be mounted on thethird circuit board 1270 a. The electronic component 1280 b disposed ina space formed between the fourth circuit board 1270 b and the secondcircuit board 1220 a may be disposed on the fourth circuit board 1270 b.The third circuit board 1270 a and the fourth circuit board 1270 b maybe arranged to be symmetric to each other with reference to the thirdinterposer 1232. At least one electronic component 1290 may be disposedon the second circuit board 1220 a on the outside of a PCB-laminatedstructure.

According to various embodiments, the interposer 1230 is formed in theshape of a closed curve surrounding an inner space formed between thefirst circuit board 1210 and the second circuit board 1220 a. Theinterposer 1230 may include: a body 1231 capable of shielding an innerspace in which the interposer 1230 is disposed; conductive members 1235a and 1235 b passing through the inside of the body 1231; and aconductive frame 1241 formed along the outer side surface of the body1231. For example, the conductive frame 1241 may have a shieldingsurface facing in a third direction (e.g., reference numerals 123, 124,125, and/or 126 in FIG. 12) substantially perpendicular to the firstdirection (e.g., reference numeral 121 in FIG. 12) or the seconddirection (e.g., reference numeral 122 in FIG. 12). The conductive frame1241 is a band-shaped component in which the shielding surface iselongated in one direction, and may surround the inner space of alaminated-type PCB substrate. The conductive frame 1241 may be disposedon the first circuit board 1210 so as to surround the at least oneelectronic component 1250 a, 1250 b, 1280 a, and 1280 b. According toone embodiment, the conductive frame 1241 may be electrically connectedto a ground portion of the first circuit board 1210.

According to one embodiment, the third interposer 1232 may support atleast a portion of the second circuit board 1220 a. The third interposer1232 supports the second circuit board 1220 a and thus can prevent thesecond circuit board 1220 a from warping.

An electronic device according to the various embodiments describedabove may use an interposer formed in a multi-step structure, in apartition structure, or in a combination thereof to divide the innerspace of a laminated-type PCB and to secure a vertical mounting space.

An electronic device according to various embodiments may prevent noiseinterference between electronic components mounted in regions separatedby a multi-step structure. An electronic device including an interposerhaving a multi-step partition structure may increase the efficiency ofarrangement of electronic components in the narrow inner space in theelectronic device.

FIG. 14A illustrates the process of manufacturing an interposerincluding a stepped portion according to an embodiment of thedisclosure, FIG. 14B illustrates the process of manufacturing aninterposer including a stepped portion according to an embodiment of thedisclosure, and FIG. 14C illustrates the process of manufacturing aninterposer including a stepped portion according to an embodiment of thedisclosure.

Referring to FIG. 14A, the interposer may be formed by laminatingmultiple layers.

According to one embodiment, a first layer 1401 including multipleconductive members 1405 may be prepared. At least one via hole 1402passing through the first layer 1401 may be formed through the firstlayer 1401. Each of the conductive members 1405 is one type of viapassing through the via hole 1402, and may be disposed in the via hole1402 to thereby pass through the first layer 1401. One surface 1405 a ofa first conductive member 1405 passed through the via hole 1402 may facein a first direction of the first layer 1401, and another surface 1405 bof the first conductive member 1405 may face in a second direction ofthe first layer 1401, which is opposite to the first direction.According to one embodiment, the first conductive member 1405 may beelectrically connected to a wire of each substrate in a laminated-typePCB and formed as a line for transmitting a signal or electric power.The first layer 1401 may include first conductive pads 1407 which areformed at respective opposite ends (in a direction of reference numerals1405 a and 1405 b) of the first conductive member 1405. Each of thefirst conductive pads 1407 may operate as a terminal in contact with thewire of the substrate.

According to various embodiments, a second layer 1411 is formed on thefirst layer 1401. The second layer 1411 may be formed to have an areanarrower than that of the first layer 1401. The second layer 1411 mayinclude a second conductive member 1415. One end of the secondconductive member 1415 may be connected to the first conductive pad 1407formed at one end of the first conductive member 1405, and the other endof the second conductive member 1415 may be connected to a secondconductive pad 1417. The second conductive member 1415 may be connectedto the first conductive member 1405. Further, the first layer 1401 andthe second layer 1411 are formed to be different from each other, and astepped portion 1490 may be formed between the first layer 1401 and thesecond layer 1411. The interposer may include: a first region 1400Bhaving a first height (hb) and including the first layer 1401; and asecond region 1400A having a second height (ha) and including the firstlayer 1401 and the second layer 1411. A circuit board disposed in thefirst region 1400B may be spaced apart from a main substrate by thefirst height (hb), and a circuit board disposed in the second region1400A may be spaced apart from the main substrate by the second height(ha).

Referring to FIG. 14B, as in FIG. 14A, the first layer 1401 includingthe first conductive member 1405 and the first conductive pads 1407 maybe prepared.

According to various embodiments, like the first layer 1401, a secondlayer 1421 may be a layer including a second conductive member 1425 anda second conductive pad 1427. The second layer 1421 may be disposed onthe first layer 1401. An interposer having a stepped portion may beformed by removing, from the second layer 1421, a region (a) in whichthe stepped portion for the interposer is required. According to variousembodiments, the region (a) may be removed from the second layer 1421 bya method such as laser etching or the like.

The interposer may include: a first region 1400B having a first height(hb) and including the first layer 1401; and a second region 1400Ahaving a second height (ha) and including the first layer 1401 and thesecond layer 1421. A circuit board disposed in the first region 1400Bmay be spaced apart from a main substrate by the first height (hb), anda circuit board disposed in the second region 1400A may be spaced apartfrom the main substrate the second height (ha).

Referring to FIG. 14C, an interposer body 1450 having a second heightmay be prepared. Multiple conductive members including a firstconductive member 1455 and a second conductive member 1465 may bearranged in the body 1450. The body 1450 may be formed of anon-conductive material.

According to various embodiments, the body 1450 may include at least onevia hole 1452 into which each of the first conductive member 1455 andthe second conductive member 1465 can be inserted. Each of the firstconductive member 1455 and the second conductive member 1465 may beelectrically connected to a wire of a laminated PCB and thus may operateas a line for transmitting a signal or electric power. The firstconductive member 1455 may include a first conductive pad 1457 formed ateach of the opposite ends thereof. The second conductive member 1465 mayinclude conductive pads 1467 and 1468 formed at respective opposite endsthereof. In one example, the second conductive member 1465 may include:a second conductive pad 1467 formed at one end thereof that is incontact with a wire of a main circuit board; and a third conductive pad1468 formed at the other end thereof.

According to various embodiments, a region (b) may be removed from thebody 1450 by laser etching in order to form a stepped portion 1490. Theregion (b) removed by laser etching may include the third conductive pad1468 and a portion of the second conductive member 1465. With theremoved region (b), the conductive pad has been removed. Thus, a fourthconductive pad 1469 may be formed at the other end of the secondconductive member 1465 which has been partially removed.

An interposer may include: a first region 1400C obtained by removing theregion (b) so as to have a first height (hc); and a second region 1400Dwhich has a second height (hd) and in which the body 1450 retains itsoriginal form. A circuit board disposed in the first region 1400C may bespaced apart from a main substrate by the first height (hc), and acircuit board disposed in the second region 1400D may be spaced apartfrom the main substrate by the second height (hd).

According to various embodiments, an electronic device (e.g., theelectronic device 600 in FIG. 6) may include: a first circuit board(e.g., the first circuit board 610 in FIG. 6); a first interposer (e.g.,the first interposer 633 a in FIG. 6) disponed on the first circuitboard and having a first height (e.g., the first height (h1) in FIG. 6);a second circuit board (e.g., the third circuit board 670 in FIG. 6)disposed on the first interposer and electrically connected to the firstinterposer; a second interposer (e.g., the second interposer 632 in FIG.6) disposed on the first circuit board so as to be formed outside thefirst interposer and having a second height (e.g., the second height(h2) in FIG. 6); and a third circuit board (e.g., the second circuitboard 620 in FIG. 6) disposed on the second interposer and electricallyconnected to the second interposer.

According to one embodiment, the first interposer may be formed in aclosed-curve shape (e.g., see FIG. 7). The second interposer may beformed in a closed-curve shape (e.g., see FIG. 7) corresponding to theshape of the first interposer, and may be disposed adjacent to the firstinterposer.

According to one embodiment, the first height may be smaller than thesecond height.

According to one embodiment, the electronic device may further include athird interposer (e.g., the third interposer 1232 in FIGS. 12 and 13)disposed across an inner space formed by the first interposer, the firstcircuit board, and the second circuit board.

According to one embodiment, the third interposer may be formed to havethe first height so as to support at least a portion of the secondcircuit board.

According to one embodiment, the third interposer may partially protrudeto the second height so as to support at least a portion of the thirdcircuit board.

According to one embodiment, the first interposer may include: a firstconductive member (e.g., the conductive member 637 a in FIG. 7)configure to connect the first circuit board to the second circuitboard; and a first through-hole (e.g., the via hole 1402 in FIG. 14A) inwhich the first conductive member is disposed. The second interposer mayinclude: a second conductive member (e.g., the conductive member 635 inFIG. 7) configured to connect the first circuit board to the thirdcircuit board; and a second through-hole (e.g., the via hole 1402 inFIG. 14A) in which the second conductive member is disposed.

According to one embodiment, the first interposer may include contactpads (e.g., the conductive pads 631 in FIG. 7) formed at respectiveopposite ends of the first conductive member. The second interposer mayinclude contact pads (e.g., the conductive pads 631 in FIG. 7) formed atrespective opposite ends of the second conductive member.

According to various embodiments, an electronic device (e.g., the secondelectronic device 400 or 1200 in FIG. 4 or 13) may include: a firstcircuit board (e.g., the first circuit board 410 or 1210 in FIG. 4 or13); a first interposer (e.g., the first interposer 430 or 1230 b inFIG. 4 or 13) disposed on the first circuit board and having a firstheight; a second circuit board (e.g., the second circuit board 420 inFIG. 4) disposed on the first interposer and electrically connected tothe first interposer; and a partition (e.g., the second interposer 432in FIG. 4 or the third interposer 1232 in FIG. 13) disposed inside thefirst interposer and formed to support at least a portion of the secondcircuit board.

According to one embodiment, the electronic device may further include:a second interposer (e.g., the second interposer 1230 a in FIG. 13)having a second height and disposed on the first circuit board so as tobe formed outside the first interposer; and a third circuit board (e.g.,the second circuit board 1220 a in FIG. 13) disposed on the secondinterposer and electrically connected to the second interposer.

According to one embodiment (see FIG. 12), the first interposer may beformed in a closed-curve shape, and the second interposer may be in aclosed-curve shape corresponding to the shape of the first interposerand may be disposed adjacent to the first interposer.

According to one embodiment, the first height may be smaller than thesecond height.

According to one embodiment, the partition may include a thirdinterposer (e.g., the third interposer 1232 in FIG. 13) formed to havethe first height so as to support at least a portion of the secondcircuit board.

According to one embodiment, the third interposer may partially protrudeto the second height so as to support at least a portion of the thirdcircuit board.

According to one embodiment, the partition may include a thirdinterposer formed to have the first height, and the third interposer mayelectrically connect the first circuit board and the second circuitboard to each other.

According to one embodiment, the first interposer may include: a firstconductive member (e.g., the conductive member 1235 b in FIG. 13)configured to connect the first circuit board to the second circuitboard; and a first through-hole (e.g., the via hole 1402 in FIG. 14A) inwhich the first conductive member is disposed. The second interposer mayinclude: a second conductive member (e.g., the conductive member 1235 ain FIG. 13) configured to connect the first circuit board to the thirdcircuit board; and a second through-hole (e.g., the via hole 1402 inFIG. 14A) in which the second conductive member is disposed.

According to various embodiments, an electronic device (e.g., theelectronic device 1000 in FIGS. 10 and 11) may include: a first circuitboard (e.g., the first circuit board 1010 in FIG. 11) which includes afirst surface (e.g., the first surface 1011 in FIG. 11), on which one ormore components are disposed and which faces in a first direction (e.g.,reference numeral 1001 in FIG. 10), and a second surface (e.g., thesecond surface 1012 in FIG. 11) facing in the opposite direction of thefirst direction; a first interposer which is disposed on the firstsurface of the first circuit board, is electrically connected to thefirst circuit board, and includes a first region having a first heightwith reference to the first surface of the first circuit board and asecond region having a second height with reference to the firstsurface; a second interposer which is disposed on the first surface ofthe first circuit board, is electrically connected to the first circuitboard, and includes a third region (e.g., reference numeral 1037 b inFIG. 11) having the first height with reference to the first surface ofthe first circuit board; a second circuit board (e.g., the third circuitboard 1020 b in FIG. 11) which faces the first surface of the firstcircuit board and is disposed on the first region of the firstinterposer and on the third region of the second interposer; and a thirdcircuit board (e.g., the second circuit board 1020 a in FIG. 11) whichfaces the first surface of the first circuit board and is disposed onthe second region of the first interposer.

According to one embodiment, the first interposer is formed by a closedcurve surrounding at least some components (e.g., the electroniccomponents 1050 a and 1050 b in FIG. 10) among the one or morecomponents. The first height may be smaller than the second height, andthe first region may be disposed toward the inside of the closed curveof the first interposer.

According to one embodiment, the second interposer may include a fourthregion (e.g., reference numeral 1037 a in FIG. 11), which is formedacross a closed curve formed by the first interposer and has the secondheight with reference to the first surface, and the fourth region maysupport the third circuit board.

According to one embodiment, the second interposer may be connected toone edge of the first interposer to form a closed curve, and the firstregion may be connected to the third region.

According to various embodiments, an electronic device may include afirst circuit board including a first electronic component and a secondelectronic component disposed on a side of the first circuit board, asecond circuit board spaced apart from the first circuit board andhaving a side facing the side of the first circuit board on which thefirst electronic component and the second electronic component aredisposed, a first interposer disposed between the first circuit boardand the second circuit board to form an inner space between the firstcircuit board and the second circuit board and a second interposerdisposed between the first circuit board and the second circuit board todivide the inner space into a first region and a second region, thefirst electronic component on the first circuit board may be disposedcorresponding to the first region, and the second electronic componenton the first circuit board may be disposed corresponding to the secondregion and the first interposer and the second interposer mayelectrically connect the first circuit board to the second circuitboard.

According to one embodiment, the first interposer may comprise aplurality of wall portions including more than one wall portion that areeach disposed along peripheral portion of the first circuit board andthe second circuit board, and the inner space may be substantiallyenclosed by the first circuit board, the second circuit board and thefirst interposer.

According to one embodiment, the second interposer may comprise a wallportion disposed across the inner space and extending from one of theplurality of wall portions of the first interposer to another one of theplurality of wall portions of the first interposer.

According to one embodiment, each of the plurality of wall portions ofthe first interposer may have a height which is equal to a height of thewall portion of the second interposer.

According to one embodiment, the first interposer may comprise a closedcurve-shaped body configured to surround the inner space, a plurality ofconductive members passing through the body; and a plurality ofthrough-holes in which the plurality of conductive members are disposed.

According to one embodiment, the closed curve-shaped body may comprise anon-conductive member in which the plurality of through-holes aredisposed; and a conductive frame disposed along the non-conductivemember and forming an outer side surface of the closed curve-shapedbody, the conductive frame configured to shield the inner space.

According to one embodiment, the conductive frame may be electricallyconnected to a ground.

According to one embodiment, the second interposer may comprise a body,a plurality of conductive members passing through the body and aplurality of through-holes in which the plurality of conductive membersare disposed.

According to one embodiment, the body may comprise a non-conductivemember in which the plurality of through-holes are disposed.

According to one embodiment, the first circuit board may comprise afirst surface facing in a first direction, the first surface being theside of the first circuit board on which the first electronic componentand the second electronic component are disposed and a second surfacefacing in a second direction.

According to one embodiment, the first direction may be opposite thesecond direction.

According to one embodiment, the second circuit board may comprise athird surface facing in the first direction and a fourth surface facingthe first surface of the first circuit board, the fourth surface beingthe side of the second circuit board facing the side of the firstcircuit board on which the first electronic component and the secondelectronic component are disposed.

According to one embodiment, the electronic device may further comprisea third electronic component disposed on the third surface of the secondcircuit board.

According to one embodiment, the first interposer and the secondinterposer may electrically connect the first electronic component andthe second electronic component arranged on the first circuit board andthe third electronic component disposed on the second circuit board.

According to one embodiment, the electronic device may further comprisea fourth electronic component disposed on the fourth surface of thesecond circuit board.

According to one embodiment, the first interposer and the secondinterposer electrically may connect the first electronic component andthe second electronic component arranged on the first circuit board andthe fourth electronic component disposed on the second circuit board.According to one embodiment, the first interposer and the secondinterposer may be integrated with each other.

According to one embodiment, at least one portion of the first circuitboard extends past the first interposer.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smart phone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude all possible combinations of the items enumerated together in acorresponding one of the phrases. As used herein, such terms as “afirst”, “a second”, “the first”, and “the second” may be used to simplydistinguish a corresponding element from another, and does not limit theelements in other aspect (e.g., importance or order). It is to beunderstood that if an element (e.g., a first element) is referred to,with or without the term “operatively” or “communicatively”, as “coupledwith,” “coupled to,” “connected with,” or “connected to” another element(e.g., a second element), it means that the element may be coupled withthe other element directly (e.g., wiredly), wirelessly, or via a thirdelement.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, and may interchangeably be used withother terms, for example, “logic,” “logic block,” “part,” or“circuitry”. A module may be a single integral component, or a minimumunit or part thereof, adapted to perform one or more functions. Forexample, according to an embodiment, the module may be implemented in aform of an application-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 1540) including one or more instructions that arestored in a storage medium (e.g., internal memory 1536 or externalmemory 1538) that is readable by a machine (e.g., the electronic device1501). For example, a processor (e.g., the processor 1520) of themachine (e.g., the electronic device 1501) may invoke at least one ofthe one or more instructions stored in the storage medium, and executeit, with or without using one or more other components under the controlof the processor. This allows the machine to be operated to perform atleast one function according to the at least one instruction invoked.The one or more instructions may include a code generated by a complieror a code executable by an interpreter. The machine-readable storagemedium may be provided in the form of a non-transitory storage medium.Wherein, the term “non-transitory” simply means that the storage mediumis a tangible device, and does not include a signal (e.g., anelectromagnetic wave), but this term does not differentiate betweenwhere data is semi-permanently stored in the storage medium and wherethe data is temporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a non-transitory machine-readable storage medium (e.g.,compact disc read only memory (CD-ROM)), or be distributed (e.g.,downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. Ifdistributed online, at least part of the computer program product may betemporarily generated or at least temporarily stored in themachine-readable storage medium, such as memory of the manufacturer'sserver, a server of the application store, or a relay server.

According to various embodiments, each element (e.g., a module or aprogram) of the above-described elements may include a single entity ormultiple entities. According to various embodiments, one or more of theabove-described elements may be omitted, or one or more other elementsmay be added. Alternatively or additionally, a plurality of elements(e.g., modules or programs) may be integrated into a single element. Insuch a case, according to various embodiments, the integrated elementmay still perform one or more functions of each of the plurality ofelements in the same or similar manner as they are performed by acorresponding one of the plurality of elements before the integration.According to various embodiments, operations performed by the module,the program, or another element may be carried out sequentially, inparallel, repeatedly, or heuristically, or one or more of the operationsmay be executed in a different order or omitted, or one or more otheroperations may be added.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a first circuitboard including a first electronic component and a second electroniccomponent disposed on a first side of the first circuit board; a secondcircuit board spaced apart from the first circuit board and having asecond side facing the first side of the first circuit board; and aninterposer disposed between the first circuit board and the secondcircuit board including: a non-conductive body disposed between thefirst circuit board and the second circuit board, a plurality of throughholes formed through the non-conductive body, and a plurality ofconductive members disposed in the plurality of through holes forelectrically connecting the first circuit board and the second circuitboard, wherein the non-conductive body includes: a first non-conductivebody having a closed-shape, and a second non-conductive body formedintegrally extending from one portion of the first non-conductive bodyto another portion of the first non-conductive body to provide a firstinner space and a second inner space spatially isolated from each other,wherein the first electronic component on the first circuit board isdisposed corresponding to the first inner space, and the secondelectronic component on the first circuit board is disposedcorresponding to the second inner space, and wherein a conductiveportion is formed along a side surface of the second non-conductivebody, the conductive portion is configured to shield the secondelectronic component disposed in the second inner space from the firstelectronic component disposed in the first inner space.
 2. Theelectronic device of claim 1, wherein the first non-conductive bodycomprises a plurality of wall portions including more than one wallportion that are each disposed along peripheral portion of the firstcircuit board and the second circuit board, wherein the first innerspace is substantially enclosed by the first circuit board, the secondcircuit board and the first non-conductive body, wherein the secondnon-conductive body comprises a wall portion formed of a non-conductivemember, and wherein at least one conductive member included in the wallportion of the second non-conductive body from the plurality ofconductive members is configured to shield one of the first inner spaceand the second inner space from the other.
 3. The electronic device ofclaim 2, wherein the wall portion of the second non-conductive bodyextends from one of the plurality of wall portions of the firstnon-conductive body to another one of the plurality of wall portions ofthe first non-conductive body.
 4. The electronic device of claim 3,wherein each of the plurality of wall portions of the firstnon-conductive body has a height which is equal to a height of the wallportion of the second non-conductive body.
 5. The electronic device ofclaim 1, wherein conductive structure portions are electricallyconnected to a ground.
 6. The electronic device of claim 1, wherein thefirst circuit board comprises: a first surface facing in a firstdirection, the first surface being the first side of the first circuitboard on which the first electronic component and the second electroniccomponent are disposed; and a second surface facing in a seconddirection.
 7. The electronic device of claim 6, wherein the firstdirection is opposite the second direction.
 8. The electronic device ofclaim 6, wherein the second circuit board comprises: a third surfacefacing in the first direction; and a fourth surface facing the firstsurface of the first circuit board, the fourth surface being the secondside of the second circuit board facing the first side of the firstcircuit board on which the first electronic component and the secondelectronic component are disposed.
 9. The electronic device of claim 8,further comprising: a third electronic component disposed on the thirdsurface of the second circuit board.
 10. The electronic device of claim9, wherein the interposer electrically connects the first electroniccomponent and the second electronic component arranged on the firstcircuit board and the third electronic component disposed on the secondcircuit board.
 11. The electronic device of claim 9, further comprising:a fourth electronic component disposed on the fourth surface of thesecond circuit board.
 12. An electronic device comprising: a firstcircuit board including a first electronic component and a secondelectronic component disposed on a side of the first circuit board; asecond circuit board spaced apart from the first circuit board andhaving a side facing the side of the first circuit board on which thefirst electronic component and the second electronic component aredisposed; a first interposer disposed between the first circuit boardand the second circuit board to form an inner space between the firstcircuit board and the second circuit board; and a second interposerdisposed between the first circuit board and the second circuit board todivide the inner space into a first region and a second region, whereinthe first electronic component on the first circuit board is disposedcorresponding to the first region, and the second electronic componenton the first circuit board is disposed corresponding to the secondregion, wherein the first interposer and the second interposer comprisea plurality of through-holes in which a plurality of conductive membersare disposed, wherein the first interposer comprises a closedcurve-shaped body configured to surround the inner space, and aplurality of conductive members passing through the body, wherein thefirst circuit board and the second circuit board are electricallyconnected via the plurality of conductive members, wherein the firstinterposer comprises a plurality of wall portions including more thanone wall portion that are each disposed along peripheral portion of thefirst circuit board and the second circuit board, wherein the innerspace is substantially enclosed by the first circuit board, the secondcircuit board and the first interposer, wherein the second interposercomprises a wall portion formed of a non-conductive member and aconductive member disposed across the inner space, and wherein theconductive member of the wall portion of the second interposer isconfigured to shield one of the first region and the second region fromthe other.
 13. The electronic device of claim 12, wherein the firstcircuit board comprises: a first surface facing in a first direction,the first surface being the side of the first circuit board on which thefirst electronic component and the second electronic component aredisposed; and a second surface facing in a second direction.
 14. Theelectronic device of claim 12, wherein the first interposer and thesecond interposer are integrated with each other.
 15. The electronicdevice of claim 12, wherein at least one portion of the first circuitboard extends past the first interposer.
 16. An electronic devicecomprising: a first circuit board including communication circuitry andelectronic components disposed on a side of the first circuit board; asecond circuit board having a side facing the side of the first circuitboard on which the communication circuitry and electronic components aredisposed; and an interposer including a non-conductive body disposedbetween the first circuit board and the second circuit board, aplurality of conductive members disposed in the non-conductive body forelectrically connecting the first circuit board and the second circuitboard, and conductive structure portions formed along an inner sidesurface and an outer side surface of the non-conductive body, whereinthe interposer includes a first interposer portion having a closedcurve-shape to form an inner space between the first circuit board andthe second circuit board, and a second interposer portion formed todivide the inner space into a first inner sub-space and a second innersub-space spatially isolated from each other, and wherein the conductivestructure portions corresponding to the second interposer portion areconfigured to shield the electronic components disposed in the firstinner sub-space from the communication circuitry disposed in the secondinner sub-space.
 17. The electronic device of claim 16, wherein at leastone of the conductive structure portions formed along the side surfacesof the non-conductive body is electrically connected to a ground of thefirst circuit board.
 18. The electronic device of claim 17, wherein thenon-conductive body comprises a plurality of through-holes in which theplurality of conductive members are disposed.
 19. The electronic deviceof claim 16, wherein the non-conductive body comprises a plurality ofthrough-holes in which the plurality of conductive members are disposed.